Abstract
Al2O3/GeOx/Ge gate stack fabricated by an in situ cycling ozone oxidation (COO) method in the atomic layer deposition (ALD) system at low temperature is systematically investigated. Excellent electrical characteristics such as minimum interface trap density as low as 1.9 × 1011 cm−2 eV−1 have been obtained by COO treatment. The impact of COO treatment against the band alignment of Al2O3 with respect to Ge is studied by x-ray photoelectron spectroscopy (XPS) and spectroscopic ellipsometry (SE). Based on both XPS and SE studies, the origin of gate leakage in the ALD-Al2O3 is attributed to the sub-gap states, which may be correlated to the OH-related groups in Al2O3 network. It is demonstrated that the COO method is effective in repairing the OH-related defects in high-k dielectrics as well as forming superior high-k/Ge interface for high performance Ge MOS devices.
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