Abstract
This research investigates the effects of Ni, Ti, and Zn foil as interlayer, inserted between the faying edges of Al and Cu plates, for controlled intermetallic compound (IMC) formation. The weld tensile strength with Ti and Zn as interlayer is superior to Al base metal strength. This is due to controlled flow of IMCs by diffused Ti interlayer and thin, continuous, and uniform IMC formation in the case of Zn interlayer. Improved flexural stress was observed with interlayer. Weld microhardness varied with different interlayers and purely depends on IMCs present at the indentation point, flow of IMCs, and interlayer hardness. Specimens with interlayer failed at the interface of the nugget and thermomechanical-affected zone (TMAZ) with complete and broken three-dimensional (3-D) grains, indicating transgranular fracture. Phase analysis revealed that Al/Cu IMCs are impeded by Ni and Ti interlayer. The minor binary and ternary IMC phases form adjacent to the interlayer due to diffusion of the material with Al/Cu. Line scan and elemental mapping indicate thin, continuous, and uniform IMCs with enhanced weld metallurgical and mechanical properties for the joints with Zn interlayer. Macrostructural analysis revealed IMC flow variations with and without interlayer. Variation in grain size at different zones is also observed for different interlayers.
Published Version
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