Abstract
In this work, air plasma was employed to modify the surface of epoxy resin substrate for subsequent electroless copper plating. The influence of plasma modification on the interface performance of epoxy resin substrate was analyzed by multiple characterizations including morphological, chemical and surface tension-based measurements. The results show that the wettability and roughness of epoxy resin substrate are substantially increased after air plasma modification. The roughened shape and the oxidized chemical groups at surface are the major causes of modified interface properties of epoxy resin substrate. Subsequent electroless copper plating tests demonstrate that this air plasma treatment significantly improves the quality of copper deposition for printed circuit board manufacture.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
