Abstract

Roughness measurements on epitaxial layers before and after etching were done with an atomic force microscope (AFM) with sub-Angstrom repeatability. Furthermore, surface roughness was monitored with AFM after chemical mechanical polishing, before a wafer was bonded to another wafer. It was observed that measuring in non-contact mode reduces the tip wear and extends the life time of AFM tips. We also show that a resist recess in narrow trenches which cannot be measured with scatterometry is easily measured with a high-aspect-ratio tip on AFM. The offset between the AFMs in two different fabs is currently less than 5 nm, when a trench depth recipe is transferred from one tool to another.

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