Abstract
ABSTRACTMicrostructural characterization of thin film (Au-Pt-Ti) and thick film (Mo-Mn) metallization on AIN substrates has been performed using Transmission Electron Microscopy (TEM), Analytical Electron Microscopy (AEM), Convergent Beam Electron Diffraction (CBED) and Auger Electron Spectroscopy (AES). The reaction mechanisms for both types of metallization methods are proposed. In particular, the microchemical and morphological nature of grain boundary penetration and precipitation within the AIN near the metallization interface has been examined.
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