Abstract
This paper reports on the fabrication of X-ray waveguides, manufactured by e-beam lithography, reactive ion etching and wafer bonding techniques. By combination of these processing steps, long empty (air) channels with cross-sections in the range of 10 to 100nm are obtained, forming a guiding layer, surrounded by a solid state cladding. Aside from silicon, we present also waveguide channels fabricated in germanium and quartz. The improved fabrication protocols lead to significantly enhanced exit flux for imaging applications. Finally, we address not only straight channels, but a large variety of various geometries, as required for different applications.
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