Advanced wafer level technology: Enabling innovations in mobile, IoT and wearable electronics

Abstract

New and emerging applications in the consumer and mobile space, the growing impact of the Internet of Things (IoT) and wearable electronics (WE), and the slowdown of Moore's law have been driving many new trends and innovations in advanced packaging technology. The semiconductor industry now has to focus on integration and system scaling to meet the ever-increasing electronic system demands for performance and functionality as well as the reduction of form factor, power consumption and cost. This paradigm shift from chip-scaling to system-scaling will reinvent microelectronics packaging, continue driving system bandwidth and performance, and help sustain Moore's Law. It also drives overall demand for maximum functional integration in the smallest and thinnest package with the lowest cost. The challenge for the semiconductor industry is to develop a disruptive packaging technology platform capable of achieving these goals. The most promising solutions in volume production today are advanced Wafer Level Packaging, such as Fan-out Wafer Level Packaging (FOWLP), embedded Wafer Level Ball Grid Array (eWLB) which provides significant bandwidth, performance, form factor and cost benefits compared to other packaging technologies available today. This article will discuss the wide range of FOWLP/eWLB adoptions and new features available for mobile, IoT and WE. This advanced technology is well designed for RF, MEMS/sensors, 3D SiP modules as well as thin, highly integrated packaging solutions. Innovative FOWLP/eWLB features will be also introduced with the merits and characterization data for specific applications.