Abstract
Faced with LCCC growth and their widespread acceptance for military applications, Crouzet has planned a two‐way approach for SMDs with MLTF (multilayer thick film) hybrids and advanced PWBs. This paper deals with the R&D programme carried out on both technologies. It briefly addresses MLTF interconnects under a CNES qualification programme and now being used and describes PWB R&D: first investigation and screening, optimisation programme and improvement of large advanced PWB processing. Data are given on the material analysis, TCE measurements, MLB assembly, PTH (plated‐through‐holes), solder joints and thermal analysis.
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