Abstract
This paper discusses Fault Detection and Classification (FDC) deployed in high-volume manufacturing for the Tantalum Nitride (TaN) reactive sputtering process. TaN thin film resistors (TFR) with an average sheet resistance (R <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">s</inf> ) of 50 ohms/sq with high uniformity and negative temperature coefficient of resistance (TCR) were achieved. Optimizing interdiction capabilities for real-time prevention and detection of parameter excursions strengthened statistical process control (SPC) and improved yield.
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