Abstract

LED luminaires are already beyond retrofit systems, which are limited in heat dissipation due to the old fitting standards. Actual LED luminaries are based on new LED packages and modules. Heat dissipation through the first and second level interconnect is a key issue for a successful LED package. Therefore the impact of known bonding technologies as gluing and soldering and new technologies like sintering and transient liquid phase soldering were analyzed and compared. A realized hermetic high power LED package will be shown as example. The used new techniques result in a module extremely stable against further assembly processes and harsh operating conditions.

Highlights

  • LED luminaires as replacement for typical light bulbs already gained a significant share in the market and reached a suitable reliability

  • Beyond retrofit more challenging luminaires become possible with LEDs, like light sources for material processing, luminaires for film studios, UV-emitters for water purification and light sources for harsh environment with high temperature, moisture and corrosive gases

  • Transient liquid phase soldering is an approach with the goal to do assembly with standard pick and place equipment in a quick reflow process

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Summary

INTRODUCTION

LED luminaires as replacement for typical light bulbs already gained a significant share in the market and reached a suitable reliability. Beyond retrofit more challenging luminaires become possible with LEDs, like light sources for material processing, luminaires for film studios, UV-emitters for water purification and light sources for harsh environment with high temperature, moisture and corrosive gases. In most cases those trend-setting solutions need perfect heat dissipation close to the chip, as the heat flux density will be the highest in the package and the socket will not be the limiting factor anymore. The successful combination of those techniques to reach challenging packaging request will be shown for one example

PACKAGING TECHNOLOGIES
Basics
Procedure
Field of Application
EXEMPLARY HERMETIC LED PACKAGE
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