Abstract
An acid Cu–Sn deposition bath was developed, and copper and copper–tin coatings were electrodeposited on polycrystalline platinum. The effect of gelatin on copper and copper–tin electrodeposition from acid sulfate solutions has been investigated by a variety of electrochemical methods (voltammetric studies and electrochemical quartz crystal microbalance) as well as by morphologic technique (scanning electron microscopy). The electrochemical results have shown that the overpotential is required when gelatin is added, indicating the presence of interaction between the additive and the coating. From the results of X-ray photoelectron spectroscopy, PM-IRRAS and cyclic voltammetry, gelatin was found to react with metal ions and platinum substrate. Adsorption of gelatin on the coating and platinum substrate is shown. Gelatin adsorption seemed to inhibit the initial nucleation of the copper and copper–tin electrodeposition, allowing homogeneous and smaller crystallites. Addition of gelatin was found to have an effect on reducing copper–tin alloys. The presence of gelatin impacts the crystal size and morphology of Cu–Sn deposits.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
