Adhesive Property of Several Engineering Plastic Films Treated with Sputter Etching and Argon Low Temperature Plasma.

Abstract

Engineering plastic films such as polyethylene terephthalate, nylon 6, polyimide, p-aramid, polycarbonate and Polyphenylene sulfide were treated with sputter etching and low temperature argon plasma, and their adhesive properties were investigated in relation to critical surface tension, SEM photograph and ESCA measurement. Peel strength increased by sputter etching and argon low temperature plasma treatments, especially with the former. Although critical surface tension increases by both treatments in one minute, adhesive property considerably increases by sputter etching over 3 min, because the treatment causes physical change such as surface roughness and protrusion. Thus, the sputter etching seems much more effective to increase the peel strength.