Abstract
AbstractA mathematical model is presented which describes the degree of cure in a thermosetting adhesive used to bond sheet molding compound (SMC) components. The model allows computer aided optimization of the thermosetting process for any type of electromagnetic heating of the various layers of the structure (e.g. dielectric, microwave or induction), arbitrary material properties and arbitrary layer thickness. Computer simulated results are given for the particular case when the cure of the thermosetting material is initiated by its exposure to a high‐power radio‐frequency electric field (dielectric heating). These results indicate a strong sensitivity of the process to the thickness of the adhesive layer and the degree of coupling with the electromagnetic field. The analysis demonstrates that substantial heat losses from the relatively thin adhesive layer to the structural members of the joint by diffusive heat flow can be counterbalanced by additional electric power dissipated either in the adhesive or the structural members of the joint. Although derived for dielectric heating, those results are general, being independent of the type of electromagnetic heating employed.
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