Abstract
A novel method for determination of adhesion strength between electroformed layer and substrate was developed in a quantitative manner and applied to electroformed nickel – AISI 304L substrate system. This method was based on the creation of a discontinuity on the substrate by electrical discharge machining (EDM) in such a way that the only force which held the structure together became the adhesion strength between the substrate and electroformed layer. Then, application of a shear load on the interface by tensile testing equipment provided quantitative results, unlike conventional adhesion tests which usually yield qualitative information. According to the results, the adhesion strength was improved by application of heat treatment and surface roughening of the substrate. Application of heat treatment caused the diffusion of atoms at the interface which increased the interfacial strength. Furthermore, increasing the surface roughness enhanced the interfacial strength by increasing the bonding area and mechanical sticking.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.