Abstract
A novel method for determination of adhesion strength between electroformed layer and substrate was developed in a quantitative manner and applied to electroformed nickel – AISI 304L substrate system. This method was based on the creation of a discontinuity on the substrate by electrical discharge machining (EDM) in such a way that the only force which held the structure together became the adhesion strength between the substrate and electroformed layer. Then, application of a shear load on the interface by tensile testing equipment provided quantitative results, unlike conventional adhesion tests which usually yield qualitative information. According to the results, the adhesion strength was improved by application of heat treatment and surface roughening of the substrate. Application of heat treatment caused the diffusion of atoms at the interface which increased the interfacial strength. Furthermore, increasing the surface roughness enhanced the interfacial strength by increasing the bonding area and mechanical sticking.
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