Adhesion enhancement by a dielectric barrier discharge of PDMS used for flexible and stretchable electronics

Abstract

Currently, there is a strong tendency to replace rigid electronic assemblies by mechanically flexible and stretchable equivalents. This emerging technology can be applied for biomedical electronics, such as implantable devices and electronics on skin. In the first step of the production process of stretchable electronics, electronic interconnections and components are encapsulated into a thin layer of polydimethylsiloxane (PDMS). Afterwards, the electronic structures are completely embedded by placing another PDMS layer on top. It is very important that the metals inside the electronic circuit do not leak out in order to obtain a highly biocompatible system. Therefore, an excellent adhesion between the 2 PDMS layers is of great importance. However, PDMS has a very low surface energy, resulting in poor adhesion properties. Therefore, in this paper, PDMS films are plasma treated with a dielectric barrier discharge (DBD) operating in air at medium pressure (5.0 kPa). Contact angle and XPS measurements reveal that plasma treatment increases the hydrophilicity of the PDMS films due to the incorporation of silanol groups at the expense of methyl groups. T-peel tests show that plasma treatment rapidly imparts adhesion enhancement, but only when both PDMS layers are plasma treated. Results also reveal that it is very important to bond the plasma-treated PDMS films immediately after treatment. In this case, an excellent adhesion is maintained several days after treatment. The ageing behaviour of the plasma-treated PDMS films is also studied in detail: contact angle measurements show that the contact angle increases during storage in air and angle-resolved XPS reveals that this hydrophobic recovery is due to the migration of low molar mass PDMS species to the surface.