Adhesion Characteristics Analysis of Wafer Transfer Plane based on the Acceleration Adjustment

Abstract

As a key element in the semiconductor industry, efficient and stable transfer of the wafer set the very high re- quest to the wafer transfer manipulator.At present,wafer transfer robot(SCARA-type,R-θ type) widely used in IC manu- facturing equipment can only realize translational transmission to wafer,can not realize the posture change.So wafer trans- fer acceleration can only rely on its own gravity to generate frictional force to achieve, translational transmission greatly limits the transmission efficiency of wafer.In response to this shortage, this paper,starting from analyzing the adhesion mechanism of microstructure array, analyzes the wafer transfer acceleration performance. The result shows that: the max- imum acceleration using the way of pose adjustment transfer wafer is up to 7.6m/s2 , much larger than the acceleration by the way of horizontal pose transmission.