Abstract
This paper analyzes the decision method for selecting components of gripping devices for wafer transfer robots from the system point of view and thus provides the basis for type selection and design. Analysis is completed through four steps: First, introduce the role of wafer transfer robot and gripping device in IC manufacture system and analyze the fundamental functions that are essential for wafer gripping; Second, analyze wafer gripping device systematically and divide it into six parts which are called basic elements and provide the implementation methods respectively; Third, analyze and summarize specific requirements to wafer gripping device in wafer transfer process; Finally, analyze and compare the relativity between each basic element and the specific requirement, then give the analysis result in the use of a data table. Through the above analysis of this paper, designers of wafer transfer robot can do analysis and comparison to select suitable components for wafer gripping device, thereby shorten the design circle of robots and improve efficiency.
Highlights
With the rapid development of information industry, IC(Integrated Circuit) manufacture has come into a brand new era and become one of new technologies that contribute to the nation’s economy and informationization of the society
IC manufacture equipment plays an important role in IC manufacture, while higher powered IC manufacture equipment is the technical precursor in whole IC industry
Research of wafer transfer robot and wafer gripping device is of positive significance
Summary
With the rapid development of information industry , IC(Integrated Circuit) manufacture has come into a brand new era and become one of new technologies that contribute to the nation’s economy and informationization of the society. Wafer transfer robots are key facilities of IC manufature equipment which are used to transfer and position wafers between working procedures. The process of wafers consists of several procedures in which robots (Fig. 1[3]) are used to transfer wafers. Vacuum gripping is to use air pressure to adsorb wafer. As wafers are sometimes transferred and processed in a vacuum in which vacuum gripping can not take effect, mechanical gripping devices are used[1].Their performance affects the efficiency and quality directly. Research of wafer transfer robot and wafer gripping device is of positive significance.
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