Abstract
An Sn3.5Ag4Ti(Ce, Ga) active solder is used for joining ZnS–SiO2 ceramic sputtering targets with copper backing plates at 250 °C in air. Direct soldering using the Sn3.5Ag4Ti(Ce, Ga) metal filler has been found to be a reliable and simple technique for ZnS–SiO2 ceramic bonding with ZnS–SiO2 and copper. The shear strengths for ZnS–SiO2/ZnS–SiO2 and ZnS–SiO2/Cu joints are 6.5 and 5.2 MPa, respectively. The bonding mechanism is described, with emphasis placed on the action of a rare earth element (Ce) and the active metal reaction. The interfacial reaction between Sn3.5Ag4Ti(Ce, Ga) filler metal and copper at temperatures ranging from 120 to 200 °C is conducted and discussed.
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