Abstract
We have demonstrated a full color 4-in quarter-VGA amorphous silicon active-matrix (AM) LCD (AM-LCD) with 75 μm thick flexible glass backplane and frontplane substrates. The device was built directly on the flexible glass without using a processing carrier or additional protective layers. The overall thickness of the LC cell is <; 170 μ m. Process modifications were made to accommodate the flexibility and reduced thickness of the substrate. These process changes were related to: thin film deposition, photolithography, cell assembly and filling, glass scribing, and driver bonding. The achieved results indicate that the incorporated flexible glass substrates are compatible with the fabrication of high quality color AM-LCDs.
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