Abstract
Thermal interface materials (TIMs) are very crucial for better heat-transfer in electronics working as an interfacial connection between heat generators and heat sinks. This study is focused on the pressure-sensitive acrylic adhesive tape reinforced with micron-sized and nano-sized aluminum nitride (AlN) particles where the surface modification of AlN particles is done using (3-Aminopropyl) triethoxysilane (3-APTES). The physicochemical analysis of the silanized AlN particles is done using FTIR spectroscopy and scanning electron microscopy (SEM). Furthermore, thermal properties along with thermal conductivity and thermal diffusion are also studied. The main outcome of this study shows that the sample containing surface-treated AlN particles exhibits better thermal conductivity than that of the samples containing µ and nano-sized of AlN due to the comparatively better interactions with the matrix.
Highlights
In modern electronic devices such as notebook PCs, electric cars, and LEDs, thermal management is a crucial issue
Thermal interface materials (TIMs) are very crucial for better heat-transfer in electronics working as an interfacial connection between heat generators and heat sinks
Thermally conductive adhesive overcome all the problems and assure an exceptional bonding property between electrical components and heat sink, which eliminates the need for external clamping
Summary
In modern electronic devices such as notebook PCs, electric cars, and LEDs, thermal management is a crucial issue. Thermally conductive adhesive overcome all the problems and assure an exceptional bonding property between electrical components and heat sink, which eliminates the need for external clamping. Acryl, or epoxy-based double-sided thermal tapes are commonly used as thermally conductive adhesives. These tapes are thermally, mechanically, and environmentally more sustainable, more suitable for a variety of applications, and easy to design [3]. Along with the outstanding thermal conductivity, good adhesive strength and re-workability are desired in an ideal thermal conductive tape. These tapes are used to attach heat sinks to PC processors, motor control processors, or telecommunication infrastructure components [4]
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