Achieving a 3D Thermally Conductive while Electrically Insulating Network in Polybenzoxazine with a Novel Hybrid Filler Composed of Boron Nitride and Carbon Nanotubes.

Yi Wang,Kevin Schneider,Dietmar Drummer,Zhengqiang Huang,Chao Liu,Florian Tomiak,Wei Wu

doi:10.3390/polym12102331

Yi Wang, Kevin Schneider + Show 5 more

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https://doi.org/10.3390/polym12102331

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Abstract

To solve the problem of excessive heat accumulation in the electronic packaging field, a novel series of hybrid filler (BN@CNT) with a hierarchical “line-plane” structure was assembled via a condensation reaction between functional boron nitride(f-BN) and acid treated carbon nanotubes (a-CNTs). The reactions with different mass ratios of BN and CNTs and the effect of the obtained hybrid filler on the composites’ thermal conductivity were studied. According to the results, BN@15CNT exhibited better effects on promoting thermal conductivity of polybenzoxazine(PBz) composites which were prepared via ball milling and hot compression. The thermally conductive coefficient value of PBz composites, which were loaded with 25 wt% of BN@15CNT hybrid fillers, reached 0.794 W· m−1· K−1. The coefficient value was improved to 0.865 W· m−1· K−1 with 15 wt% of BN@15CNT and 10 wt% of BN. Although CNTs were adopted, the PBz composites maintained insulation. Dielectric properties and thermal stability of the composites were also studied. In addition, different thermal conduction models were used to manifest the mechanism of BN@CNT hybrid fillers in enhancing thermal conductivity of PBz composites.

Highlights

Electronic and telecommunication industries have constantly developed for over half a century, corresponding to Moore’s Law [1]
A novel hybrid filler (BN@carbon nanotubes (CNTs)) with a hierarchical “line-plane” structure was successfully fabricated through a condensation reaction
A series of hybrid fillers prepared with different mass ratios between BN and CNTs, ranging from 100:5 to 100:20

Summary

Introduction

Electronic and telecommunication industries have constantly developed for over half a century, corresponding to Moore’s Law [1]. This development seems to have slowed down in recent years. If we evaluate the progress of computers with the computing power per joule for the last. The main reason is the loop of heat accumulation- increasing operating temperature- extensive heat generation. Part of the input energy is transferred into heat during operation, which accumulates in the electronic components and causes increasing working temperature. More energy is transferred into heat owing to the rising temperature. The growing packing density accelerates this process because of the increasing power density [2]. A report revealed that every 2 degrees increase in temperature would lead to a 10% degradation in the performance of Polymers 2020, 12, 2331; doi:10.3390/polym12102331 www.mdpi.com/journal/polymers

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