Accurate and robust geometric modeling for simulation of IC and MEMS fabrication processes

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Simulation of IC (Integrated Circuit) and MEMS (Micro Electro Mechanical Systems) fabrication processes offers many interesting challenges. A fabrication step, such as a deposition or an etch, can result in significant changes to the surface profile of the structure. A fabrication process can consist of tens of these steps; therefore, the geometric modeling algorithm must be robust and memory and computationally efficient. Moreover, it should be flexible enough to be able to account for the varied geometric changes that can occur during a step. We describe voxel-based geometric modeling techniques (which exhibit these properties) for accurately modeling different types of deposition and etch steps.