Abstract
The success of coarse-pitch applications of conductive particle-filled adhesives has increased the interest in using such adhesives in fine-pitch applications, such as flip-chip on-board interconnection. Since these materials contain metallic particles to conduct currents in the z-direction (i.e., perpendicular to the plane of circuit board), their propensity for metal migration is a concern. Accelerated temperature, humidity and bias (THB) tests have been applied to a group of materials designed for fine-pitch applications. The accelerated life test conditions were 85 degrees C/85% RH at three different voltages: 10 V, 50 V, and 100 V. The studies were focused on the samples' time-to-failure as well as the associated conduction and failure mechanisms. The test results showed significant metal migrations, and enhanced electric field stresses (10/sup 2/ to 10/sup 4/ V/mm) are proposed as the driving force for failures.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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More From: IEEE Transactions on Components, Hybrids, and Manufacturing Technology
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