Abstract

The success of coarse-pitch applications of conductive particle-filled adhesives has increased the interest in using such adhesives in fine-pitch applications, such as flip-chip on-board interconnection. Since these materials contain metallic particles to conduct currents in the z-direction (i.e., perpendicular to the plane of circuit board), their propensity for metal migration is a concern. Accelerated temperature, humidity and bias (THB) tests have been applied to a group of materials designed for fine-pitch applications. The accelerated life test conditions were 85 degrees C/85% RH at three different voltages: 10 V, 50 V, and 100 V. The studies were focused on the samples' time-to-failure as well as the associated conduction and failure mechanisms. The test results showed significant metal migrations, and enhanced electric field stresses (10/sup 2/ to 10/sup 4/ V/mm) are proposed as the driving force for failures.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.