Abstract
Accelerated Induction Heating and Fast Bonding of Microchips Based on a Design of Hollow Magnetic Flux Concentrator
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
https://doi.org/10.1109/tcpmt.2024.3484997
Copy DOIPublication Date: Nov 1, 2024 |
Accelerated Induction Heating and Fast Bonding of Microchips Based on a Design of Hollow Magnetic Flux Concentrator
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.