Abstract

Previous reports on the top-gate IGZO thin-film transistors (TFTs) under negative bias illumination stress (NBIS) show a threshold voltage (VTH) shift to the left. However, in the present study, a right shift in VTH was observed in the reverse-sweep current–voltage (I–V) curves after applying NBIS to top-gate IGZO TFTs by a UV backlight. The hysteresis window of the forward and reverse sweep I–V curves widened with the increase in the stress time. The abnormal VTH shift and hysteresis-window increment are explained using an energy-band diagram. In addition, an abnormal gm peak appeared in the forward I–V curve after 2000 s of the backlight NBIS, which was verified by testing the devices with different dimensions. Silvaco TCAD simulation results indicated a strong electric field in the sidewall, confirming the generation of sub-channels. The comparison of the ΔVTH after UV backlight NBIS in three different devices suggested that the higher N2O/SiH4 flow rate and lower power deposition can produce a good quality buffer layer. A rapid examination of a buffer layer is possible using the backlight NBIS. In addition, the presence of H2 in the buffer layer was confirmed by the thermal desorption spectroscopy. Finally, the reliability of the devices can be enhanced by improving the modulation of the existing deposition process.

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