Abstract
The Al3Ti intermetallic compound (IMC) layer growth kinetics at Al-Ti interface was investigated. Surprisingly an abnormal effect of temperature was observed with a thicker IMC layer formed at lower annealing temperature due to the much faster Al3Ti grain coarsening at a higher temperature, the IMC layer growth at 630 °C became slower than that at 600 °C after a certain annealing time. The quantitative influence of grain size on effective diffusion coefficient was analysed. Calculations showed that the lattice diffusion makes little contribution to the effective diffusion coefficient. Grain boundary diffusion, therefore, dominates for all the annealing conditions studied.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
