Abstract
Low-melting point solder Sn-57Bi alloy nanoparticles were synthesized and encapsulated with abietic acid (aa) thin layer to form a core-shell structure. Formation of nanoparticle enhances its mechanical strength by decreasing strain value. Comparing to traditional rosin-alloy mixture (solder paste), the core-shell structure is more efficient on metal oxide reduction due to interaction enhancement and contacting area enlargement between alloy nanoparticles and abietic acid. Thin film can be formed through reflowing core-shell nanoparticles on copper foil. This research is beneficial on developing an efficiently oxidation resistant solder for electronic packing.
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