Abstract
Wire bonds are one of the most common interconnects used in microelectronics; however, their application to millimeter wave monolithic microwave integrated circuits (MMICs) may severely decrease the overall system performance due to transmission loss, radiation loss, and impedance mismatch. The goal of this work was to optimize a wire-bonded patch antenna to minimize losses and maximize the gain in the frequency range from 81 to 83 GHz. Optimization was based on electromagnetic simulations of different variants of the wire bond. Results show that the optimized structure demonstrates two major advantages. Firstly, it does not require any external matching network; hence, it can be directly connected to a contact pad of an MMIC die. Secondly, the wire bond radiation effect is utilized to enhance the patch antenna gain at the broadside direction.
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