Abstract
An automated gold wire bonder was characterized for bonding 1-mil gold wires to gallium-arsenide (GaAs) monolithic microwave integrated circuits (MMICs) which are used in microwave radar transmitter-receiver (T/R) modules. Acceptable gold wire bond test results were obtained for the fragile, 5-mil-thick GaAs MMICs with gold-metallized bond pads; and average wire bond pull strengths, shear strengths, and failure modes were determined. An automated aluminum wire bonder was modified to be used as a gold wire bonder so that a wedge bond capability was available for GaAs MMICs in addition to the gold ball bond capability.
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