Abstract
Antenna-in-Package has been widely applied for millimeter-wave systems that integrate the MMIC chip and antenna into one package. For organic substrate Antenna-in-Package solutions, probe feeding and aperture-coupled feeding patches are generally used as radiation units. In this work, a patch antenna is proposed using coupled resonation; a wideband, high-gain and compact 3-D antenna package integration is realized. An equivalent circuit model is analysed for the coupled structure. λ/4 coupled line is adopted for impedance matching, the whole antenna is designed on the same thick radiation patch substrate, with less organic substrate lamination layers. For millimeter-wave Antenna-in-Package structures, vias are generally used for vertical interconnections, which function well in the lower millimeter-wave frequency range. For operation frequency higher than 100GHz, design difficulties may be encountered for via interconnection, with performance degeneration on impedance matching and transmission loss. This work integrates a H-shaped slot instead of vias on an organic substrate, realizing a high frequency and wideband mm-wave transition. An interconnection structure is also adopted to convert a microstrip line to differential microstrip line in the feeding network. Antenna prototype with 2×4 radiation array is designed for verification purpose at 20GHz frequency range with simulated bandwidth of 23%. The prototype is fabricated with separate PCB boards assembled with screws, measured antenna gain is 12.7dBi-13.5dBi. The proposed structure provides a wideband and low-loss solution for potential higher frequency mm-wave Antenna-in-Package applications.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
