Abstract

We present a low-loss power combiner, providing a highly integrated interface from an array of mm-wave power amplifiers (PAs) to a single standard rectangular waveguide (WG). The PAs are connected to an array of parallel and strongly coupled microstrip lines that excite a substrate integrated waveguide (SIW) based cavity. The spatially distributed modes then couple from the cavity to the rectangular WG mode through an etched aperture and two stepped ridges embedded in the WG flange. A new co-design procedure for the PA-integrated power combining module is presented that targets optimal system-level performance: output power, efficiency, linearity. A commercial SiGe quad-channel configurable transmitter and a standard gain horn antenna were interfaced to both ends of this module to experimentally demonstrate the proposed power combining concept. Since the combiner input ports are non-isolated, we have investigated the effects of mutual coupling on the transmitter performance by using a realistic PA model. This study has shown acceptable relative phase and amplitude differences between the PAs, i.e. within ±15° and ±1 dB. The increase of generated output power with respect to a single PA at the 1-dB compression point remains virtually constant (5.5 dB) over a 42% bandwidth. The performed statistical active load variation indicates that the interaction between the PAs through the combiner has negligible effect on the overall linearity. Furthermore, the antenna pattern measured with this combiner shows negligible deformation due to non-identical PAs. This represents experimental prove-of-concept of the proposed spatial power combining module, which can be suitable for applications in MIMO array transmitters with potentially coupled array channels.

Highlights

  • H IGHLY integrated millimeter-wave transceivers with high output power and efficiency are of high demand for the next-generation wireless communication systems, imaging, and radar applications

  • The results show that good performance can be expected as long as power amplifiers (PAs) gain variations remain within ±15◦ for the phase and ±1 dB for the amplitude

  • The joint optimization procedure of a spatial power combining module has been proposed and proven necessary to account for the critical effects of coupled PAs and to improve the large-signal performance of the combined PA

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Summary

Introduction

H IGHLY integrated millimeter-wave transceivers with high output power and efficiency are of high demand for the next-generation wireless communication systems, imaging, and radar applications. The typical RF power that needs to be delivered by power amplifiers (PAs) in emerging applications is beyond the current stateof-the-art of silicon devices due to their relatively low breakdown voltage [2]. This problem can be overcome by combining signals from multiple PAs into a single radiating antenna element. This approach is not well-suited for IC solutions, since an on-chip combiner as well as an antenna and its interconnecting transition should be low-loss [3]–[6].

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