A Wideband and Low Loss Millimeter-wave MMIC Packaging Based on HTCC Technology

Abstract

According to the coplanar waveguide, an interconnection and packaging solution for millimeter-wave monolithic microwave integrated circuit (MMIC) is designed based on high-temperature co-fired ceramic (HTCC) technology. By optimizing the transmission structure model with HFSS software, the designed structure has extraordinarily low return loss, insertion loss and wide bandwidth. This packaging concept has been measured up to the Ka band. The package samples are manufactured based on multilayer high-temperature co-fired ceramic process. The package samples are measured by vector network analyzer, 500μm pitch air coplanar probes and matching fixture. After considering the influence of test substrate and bonding wire, the measured return loss and insertion loss are consistent with simulation result. Over a wide frequency range from DC up to 40 GHz, the insertion loss is better than 1.2 dB and the return loss is better than 13 dB.