Abstract
AbstractAn embossing strategy involving a hot station and a cold station for sequentially heating and cooling the embossing tool was investigated to reduce cycle times in hot embossing polymer microstructures. Experimental studies showed that aluminum stamps with a thickness of 1.4 mm can be rapidly heated from room temperature to 200°C in 3 s using contact heating against a hot station at 250°C. Microchannels and microlenses were successfully embossed onto high‐density polyethylene and acrylonitrile–butadiene–styrene substrates using a heating time less than 3 s and a total cycle time around 10 s. The two‐station embossing process for the microlens was also numerically studied. The simulated filling behavior agreed with the experimental observation and the predicted thermal and deformation history of the polymer offered a good explanation on the experimentally observed process characteristics. POLYM. ENG. SCI., 47:530–539, 2007. © 2007 Society of Plastics Engineers.
Published Version
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