Abstract
Sulfur-rich environments, such as those found in the paper and pulp industry, create a special problem with the silver plating in switchgear and motor control centers (MCCs). Silver plating is used throughout switchgear because of its superior conductivity and longevity. Silver is very sensitive to the presence of hydrogen sulfide (H/sub 2/S), which forms silver sulfide (Ag/sub 2/S), even at a very low concentration of corrosive gas. Nonuniform growth occurs in forms of "clumps," "dendrites," "nodules," and "whiskers". The decomposition of the contact surfaces leads to an increase of the contact resistance, hence, to a rise in temperature, and eventually to possible failure. This article analyzes the major factors initiating and accelerating the growth of the whiskers on silver plating in electrical apparatus.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
