Abstract

Plasma treatment and 10% NH4OH solution rinsing were performed on a germanium (Ge) surface. It was found that the Ge surface hydrophilicity after O2 and Ar plasma exposure was stronger than that of samples subjected to N2 plasma exposure. This is because the thin GeOx film formed on Ge by O2 or Ar plasma is more hydrophilic than GeOxNy formed by N2 plasma treatment. A flat (RMS < 0:5 nm) Ge surface with high hydrophilicity (contact angle smaller than 3°) was achieved by O2 plasma treatment, showing its promising application in Ge low-temperature direct wafer bonding.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call