A thermal-sensitive design of a 3D torus-based optical NoC architecture

Abstract

In order to overcome limitations of traditional electronic interconnects in terms of power efficiency and bandwidth density, optical networks-on-chip (NoC) based on silicon photonics have been proposed as an emerging on-chip communication architecture for chip multiprocessors (CMPs) with large core counts. However, due to thermo-optic effects, wavelength-selective silicon photonic devices such as microresonators suffer from temperature-dependent wavelength shift. In this work, we propose a thermal-sensitive design of a 3D torus-based optical NoC architecture. For the 3D torus-based optical NoC architecture, we propose a hybrid optical-electronic router architecture with a fully-connected 7 × 7 optical switching fabric. Besides, a thermal-sensitive routing algorithm is proposed to optimize the optical power loss in the presence of on-chip temperature variations. Simulation results show that for a set of synthetic traffic patterns, the proposed 3D torus-based optical NoC with the thermal-sensitive routing reduces the average thermal-induced optical power loss by 14.3% and 17% respectively as compared to the matched 3D torus-based optical NoC and the 3D mesh-based optical NoC with the traditional XYZ routing. For a set of real applications, the proposed 3D torus-based optical NoC with the thermal-sensitive routing reduces the worst-case optical power loss by 7.9% and 14.6% respectively as compared to the matched 3D torus-based optical NoC and the 3D mesh-based optical NoC with the traditional XYZ routing.