Abstract
The more complicated electronic packages and associated cooling facilities become, the more vital the needs for effective mathematical modelling of the behaviours of these systems. Such modelling permits (i) more accurate thermal analyses to be achieved, and (ii) the selection of efficient, cost–effective optimised designs and thermal–management practices. An adaptive and hierarchical steady–state finite–difference technique is employed in a fast–action thermal analysis template to model a naturally–cooled integrated circuit–board. The temperature distribution over such a board is presented in a three–dimensional (3–D) colour isometric projection. These high temperature spots, so identified, indicate where further design attention should be devoted, in order that longer–life, more–efficient packages may be developed.
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