Abstract
Certain special-shaped devices, such as traveling wave tubes, can be called hollow cylindrical structures in aerospace engineering and other applications. However, the structural complexity of such devices means that their heat dissipation characteristics cannot be measured directly using conventional techniques. The present work describes a method to directly measure such devices’ thermal resistance by semiconductors’ temperature-sensitive parameters. We prepared a special probe to collect transient temperature response, and the differential structure-function curves were obtained by processing the data using the structure-function method. We demonstrate that this method can effectively characterize cylindrical devices’ thermal resistance and detect differences caused by different processes and structures.
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