Abstract
The aroused quest to reduce the delay at the interconnect level is the main urge of this paper, so as to come across a configuration of carbon nanotube (CNT) bundles, namely, squarely packed bundles of mixed CNTs. The demonstrated approach in this paper makes the mixed CNT bundle adaptable to adopt for high-speed very-large-scale integration (VLSI) interconnects with technology shrinkage. To reduce the delay of the proposed configuration of the mixed CNT bundle, the behavioral change of resistance (R), inductance (L), and capacitance (C) has been observed with respect to both the width of the bundle and the diameter of the CNTs in the bundle. Consequently, the performance of the modified bundle configuration is compared with a previously developed configuration, namely, squarely packed bundles of dimorphic MWCNTs in terms of propagation delay and crosstalk delay at local-, semiglobal-, and global-level interconnects. The proposed bundle configuration is, ultimately, enacted as the better one for 32-nm and 16-nm technology nodes, and is suitable for 7-nm nodes as well.
Highlights
The overwhelming exploitation of interconnects to the device delay makes researchers weigh Carbon Nanotubes (CNTs) for the possession pertinent to long mean free path [1], electrical properties [1,2], thermal properties [2,3], electromigration, and current density [4]
This section illustrates the performance comparison of a squarely packed bundle of dimorphic MWCNTs and that of mixed CNTs to exploit the feature of using mixed CNTs in the interconnect bundle
To validate the RLC value of the proposed model, the conductance and inductance of the mixed CNT bundle is observed by varying the probability of metallic CNT (%) using Equation (1)
Summary
The overwhelming exploitation of interconnects to the device delay makes researchers weigh Carbon Nanotubes (CNTs) for the possession pertinent to long mean free path [1], electrical properties [1,2], thermal properties [2,3], electromigration, and current density [4]. Crosstalk delay is a potential stymie for CNTs due to capacitive coupling between adjacent bundles [5] While it is brought up, in previous literature [1], that the performance will be meliorated with further technology scaling, CNTs can render much better performance based on the exploration of some features. It is claimed in [5,6] that mutual inductance does not have a considerable impact on crosstalk-induced delay and glitches; instead, coupling capacitance with electrostatic and quantum capacitance makes the main contribution. From earlier work [5], that SWCNT and DWCNT shows poorer performance than Cu-based interconnects, owing to higher coupling capacitances, we endeavored to avoid putting any SWCNTs and DWCNTs on the edge of the bundle in our configuration
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