Abstract
A test structure for analysis of temperature distribution in stacked IC, which has a top tier chip attached on a bottom dummy chip with adhesive layer, is presented. The devices with four kinds of thickness of 50-410 um were fabricated. Dependences of the temperature on distance from the heater resistor were analyzed with on-chip sensor arrays, as well as fast transient phenomena. The thinner top tier structures showed the higher temperature and affected the temperature distributions. The test structure can provide an effective way for analysis of thermal properties in various LSIs.
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