A systematic methodology for creep master curve construction using the stepped isostress method (SSM): a numerical assessment

Abstract

Long-term creep of viscoelastic materials is experimentally inferred through accelerating techniques based on the time–temperature superposition principle (TTSP) or on the time–stress superposition principle (TSSP). According to these principles, a given property measured for short times at a higher temperature or higher stress level remains the same as that obtained for longer times at a lower temperature or lower stress level, except that the curves are shifted parallel to the horizontal axis, matching a master curve. These procedures enable the construction of creep master curves with short-term experimental tests. The Stepped Isostress Method (SSM) is an evolution of the classical TSSP method. Higher reduction of the required number of test specimens to obtain the master curve is achieved by the SSM technique, since only one specimen is necessary. The classical approach, using creep tests, demands at least one specimen per each stress level to produce a set of creep curves upon which TSSP is applied to obtain the master curve. This work proposes an analytical method to process the SSM raw data. The method is validated using numerical simulations to reproduce the SSM tests based on two different viscoelastic models. One model represents the viscoelastic behavior of a graphite/epoxy laminate and the other represents an adhesive based on epoxy resin.