Abstract
The effective coefficient of thermal expansion (CTE) of printed circuit boards (PCBs) have a great deal of influence on the reliability of solder joints in microelectronic packages. In this paper we carryout a systematic characterization of nineteen circuit board samples using strain gages, further validated by moire/spl acute/ interferometry, to understand the impact of CTE variation on the reliability of solder joints. It is shown that the measured effective coefficient of thermal expansion varied in a wide range by as much as 5 PPM about the commonly used value of 17 PPM. This is shown to cause a significant reliability impact for a representative plastic ball grid array package assembly. The comparison between strain gage and moire/spl acute/ interferometry showed good overall correlation, but differed from each other by as much as 2.73 parts per million (PPM). The possible sources of error in each technique are identified and discussed.
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