Abstract
Thinner thickness of the subsurface damage (SSD) layer and lower surface roughness of the grinded silicon wafers should be required, which would depend on high self-sharpening ability and consistent performance of the resin bond diamond wheel used in back-grinding. In this paper application of the pore-forming agent for improving these properties of the grinding wheel was experimentally studied. The bonding strength and the grinding performance of the resin-bond diamond wheel affected by the pore-forming agent were evaluated by testing.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
