Abstract
This study proposes a development for the nanosilver adhesive, which is applicable to high efficiency LED light. The important issue of LED light is heat exhaust from LED. Generally, the middle area of LED light is increased up to 380K. Therefore, the bottleneck between LED chip and heat sink are caused by high temperature. In this work, the adhesive material between LED Chip and heat sink was newly developed for improvement of bottleneck. The nanosilver was adopted to solve heat problem of chip on board package for LED light. In order to evaluate the performance of the nanosilver adhesive, the thermal analysis was performed. Moreover both adhesive performance and heat exhaust were verified through the prototype test. From the experimental test results, it is found that the developed nanosilver adhesive has the high performance.
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