Abstract
Non-isothermal curing kinetics was studied using differential scanning calorimetry (DSC) analysis to investigate the effect of nanoclay (C30B) on crosslinking reaction of epoxidized methyl soyate bioresin modified epoxy blend curing with triethylenetetramine. The kinetic parameters were determined by using Kissinger–Akahira–Sunose method and autocatalytic model. Addition of bioresin lowered the activation energy of epoxy on account of reduced viscosity allowing better contact of resin with curing agent. On the other hand incorporation of clay within the epoxy blend increased the activation energy (Ea) of curing due to the steric effect of clay and increased viscosity. The overall order of the reaction m+n was found to be increased on addition of bioresin and decreased on incorporation of C30B clay within blend. Dynamic mechanical analysis revealed higher glass transition temperature and crosslink density of the nanocomposite. Thermal stability of epoxy blend is enhanced by addition of clay which restricted the mobility of chain and hindered the decomposition process.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
