Abstract
Potential of fiber laser grooving in silicon has been investigated with continuous wave beam and modulated beam of micro-second durations. Though silicon shows considerably high transparency for the utilized laser wavelength (1.07μm), due to the increase of absorption coefficient with temperature its micro-machining is feasible with good precision by laser. A co-axial water-jet has been employed for ejecting out the molten silicon effectively and simultaneously for rapid cooling. This in turn, overcomes the limitation of micro-machining of silicon with laser pulses of relatively longer durations and alleviates the oxidation problem also. It has been observed that with increasing water-jet speed at constant laser parameters, spatter and recast are reduced. Grooves of controlled depth in 14–520μm range, free from micro-cracks and thermal damage could be obtained by controlling the laser and process parameters. Compared to argon-jet assisted laser grooving this technique produced grooves of relatively better quality in terms of lesser micro-cracks, spatter and thermal damage.
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