Abstract
The formation of the interface between electrolessly deposited Ni(P) and an alumina substrate is investigated. Prior to metallization, the substrate is cleaned, etched, and activated with Sn, Ag, and Pd‐containing solutions. Changes in surface chemistry due to these pretreatments are analyzed with XRF and static‐SIMS. TEM plan‐view micrographs visualize the changes in surface structure during the pretreatments. The initial stages of metallization are measured on membrane model substrates. Cross‐section TEM micrographs are made of a thin Ni(P) film on the alumina ceramic, showing a columnar Ni(P) structure, a thin interfacial layer, and an intimate interfacial contact. Possible consequences for initiation and adhesion are discussed.
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