Abstract
As the increasingly demand of computer, communication and consumer electronics in recent years, flip-chip ball grid array (FCBGA) with ajinomoto build-up film (ABF) substrate is major package for performance request. But if we consider performance, substrate resource, and cost, alternative package structure is need to replace FCBGA. Hence, two alternative substrates are studied in this paper. Both coreless substrate and fan out chip on substrate (FOCoS) with build-up material apply bismaleimide triazine (BT) material are good candidates. Signal integrity and power integrity comparison between FCBGA and alternative substrates are discussed.
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