Abstract

Grain‐size measurement in thin metal films is important for many applications. Typically, techniques which examine the film surface topography, such as scanning electron microscopy (SEM) and scanning tunneling microscopy/atomic force microscopy (STM/AFM), are used for grain‐size measurement. We have studied the extent of correlation between the surface topography and microstructure in thin aluminum films containing 1.5 weight percent copper using a scanning electron microscope equipped with a heating stage and plan‐view transmission electron microscopy (TEM). Surface grooves were found on the film surface which bore no correlation to grain boundaries, suggesting that grain size measurement by SEM and AFM could produce erroneous results due to interference from surface topography. Additional information from another technique, such as TEM, is recommended for verification.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.