Abstract

The use of a nitrided chromium interlayer has been found to improve the interfacial properties of diamond films deposited on ferrous substrates. This is achieved by hindering diffusion process of carbon and iron, good adhesion of the interlayer to the steel substrate, and very stable mechanical and chemical bonding between the interlayer and the diamond film. In the present study the initial stages of diamond deposition on steel substrates coated by a nitrided chromium interlayer and on nitrided polycrystalline chromium substrates are reported. Nitridation of chromium films deposited by electrochemical methods and polycrystalline chromium substrates resulted in the formation of two chromium nitrides phases, CrN and Cr2N, and a rough surface morphology. The initial stages of diamond deposition were found to be accompanied by carburization of the substrates surface resulting in chromium carbide formation. The incubation time, diamond particle density and growth rate at the very initial stages of the deposition process were found to differ for these two substrates. It is suggested that these differences originate from different carburization rates of the two substrates. Phase transformation, recrystallization and diffusion processes in the near surface regions of both substrates resulted in very stable chemical bonding and good adhesion of the diamond film to the substrates. Raman spectra of the deposited films, on both substrates, show shift of the diamond peak position to higher wave numbers and split of the peak. These effects are associated with compressive stresses in the diamond film. Residual stresses in the deposited films were calculated from the shift of the diamond Raman peak. The residual stresses, as calculated from the Raman spectra, were found to increase with deposition time reaching values of 8.4 and 6.9 GPa for continuous diamond films on steel substrate coated with the nitrided chromium film and on nitrided chromium substrates, respectively. Based on a simple model it was estimated that thermal stress, arising from mismatch between the thermal expansion coefficient of diamond and the underlying substrates, is the major component of the compressive stress in the diamond films.

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